01
Dual bases: specials and volume on separate footprints
Huizhou has run since 2009 (~20,000 m², ~60,000 m²/month) with emphasis on special materials, polymer, COB and telecom-module boards. Ji'an opened in 2023 (~120,000 m², ~100,000 m²/month phase-1), with roughly 80% 2L/multilayer and 20% HDI. Combined phase-1 footprint is about 140,000 m² and ~160,000 m² monthly capacity — so expedite prototypes and stable volume can run in parallel.
02
Expedite windows you can plan — not only simple boards
Published expedite windows: simple 1–2L in 24H; 4–8L in 72H. Complex stack-ups, specialty materials and higher layer counts are scheduled after engineering review. The point is a lead time you can put on a project plan — not a fresh negotiation every order.
03
ERP + MES: traceable from cutting to shipment
Lines run on ERP plus MES with order/version locking and real-time process capture for end-to-end visibility and fast traceability. For audits and complaint reviews, you can return to process records by lot — not verbal explanations.
04
In-house surface finishing — fewer outside-process unknowns
In-house lines cover ENIG, OSP and resin-plugged vias, and can address common needs such as HASL, immersion silver, gold finger and peelable blue mask. Keeping critical finishing inside shortens both schedule and quality hand-offs.
05
IPC-backed inspection with 99.8% delivery yield
Inner and outer layers run 100% AOI; flying probe for prototypes and fixture test for volume; ENIG nickel/gold thickness via XRF; impedance boards verified with TDR coupons; multilayers supported by X-ray registration and microsection sampling. Delivery yield 99.8%; scrap controlled below 0.3%.
06
Certifications that open automotive and medical doors
Systems include ISO 9001, ISO 14001, IATF 16949, ISO 13485 (Ji'an), UL (USA/Canada) and RoHS / REACH. Certificate numbers and scopes are on the certifications page for supplier onboarding.
07
Free DFM before release — fewer EQ loops
Engineering reviews manufacturability before release — stack-up, holes, impedance and finish risks are surfaced early. The goal is one clear EQ pass so prototype-to-pilot cycles shrink.
08
Wide board mix: quick-turn through HF, HDI and heavy copper
Coverage spans multilayer rigid, HDI, high-frequency/high-speed, flex/rigid-flex, metal-core, heavy copper and ceramic categories, with both expedite and volume paths. Process windows and lead times are stated per board type on the manufacturing service pages — not as one vague master table.