Smart Home
Board requirements across smart home vary widely, and selection is usually driven by some combination of heat dissipation, signal integrity, structural space and reliability grade. Below are the engineering considerations that come up most often in this area, together with the 4 applicable board types we already manufacture.
Engineering considerations
- Wireless modules and antenna clearance
- Wi-Fi and Bluetooth modules are sensitive to copper clearance in the antenna zone and to reference-ground integrity; stack-up and keep-out areas are confirmed at design stage to avoid a respin after ramp.
- Volume cost control
- Smart-home products are price-sensitive and mostly two- or four-layer. Selection focuses on holding down layer count and finish cost while still meeting EMC and mechanical requirements.
Applicable board types
The board types below are the ones that come up most often in smart home applications. Each link goes to that board type's capability page with material, layer-count and process ranges. Combined constructions across board types, such as hybrid lamination or embedded copper, are confirmed by engineering review.
Production examples
The examples below are desensitized: no customer information, exact outline dimensions or full stack-up notation.
Consumer terminal and smart-home module
4L · FR-4 ITEQ IT-180A · 1.6 mm ±10% · 沉银 / Immersion silver · Mid-size (long edge roughly 100–250 mm)
- Four-layer IT-180A with immersion silver; silver gives lower high-frequency loss than HASL but is sensitive to storage environment and sulphur contamination, so vacuum anti-oxidation packing is used.
- Via-in-pad and press-fit holes on a customer-supplied stack-up; for consumer projects, lead time and batch consistency matter more than extreme parameters.
Production experience
Related end-product categories already in volume production include Documented end-product categories in smart home include smart-home gateways and hub devices.. Specific project details are covered by non-disclosure agreements and are not published.
Applicable certifications
- ISO 9001:2015 Quality Management System — 120622-2012-AQ-RGC-RvA
- ISO 14001:2015 Environmental Management System — 104573-2011-AE-RGC-RvA
- RoHS Restricted Substances Test Report — WTH23H12270526C
- REACH SVHC Test Report — WTH24H10245077C
- UL Recognized Component (USA) — Wiring, Printed — E326765 (ZPMV2)
- UL Recognized Component (Canada) — Wiring, Printed — E326765 (ZPMV8)
Frequently asked questions
- How long does a smart home project take from enquiry to prototype?
- Quotations are returned within 30 minutes as a rule. Expedited prototype lead times run by layer count: double-sided 24 hours, 4-layer 48 hours, 6–8 layer 72 hours, 10–12 layer 96 hours; single-stage HDI at 6 layers is 48 hours. Standard lead times and production scheduling are confirmed separately against order volume.
- Which inspection and material documents can you supply?
- As standard we supply a certificate of conformance, material certifications with lot records, and electrical test records; impedance test reports and microsection analysis are available on request. Acceptance can be run to IPC-6012 Class II or Class III, which must be stated on the order.
This page describes general engineering considerations for this application area and the board-type capabilities we already hold. It is not a commitment on a specific project. Exact stack-up, material grade, tolerances and acceptance criteria are confirmed through engineering review and in writing.
Routine enquiries are answered within 30 minutes. Once you upload Gerber files and technical requirements, engineering returns manufacturability findings together with the quotation, so design conflicts surface before production rather than after.