Manufacturing Tolerances
Sunking Circuits' standard tolerances. Designing with these in mind helps ensure the finished product meets expectations.
Tighter tolerances may be available on request. Please contact us for more information if a standard tolerance does not meet your specifications. Imperial values are authoritative; metric equivalents are provided for convenience.
| Item | Tolerance | Design Tip |
|---|---|---|
| Inner Layer Hole to Copper | Hole size + 0.020" (≈0.51mm) | Keep vias and component holes at least 0.010" (≈0.25mm) from copper of a different net. |
| Hole Location (Annular Ring / Pad Size) | ±0.003" (≈0.076mm) | Pads for plated holes must be at least 0.010" larger than the hole to meet IPC-6012 annular ring. |
| Board Outline | ±0.005" (≈0.13mm) | Keep outer copper ≥0.005" and inner copper ≥0.010" from the board edge (except scored arrays). |
| Scoring | Location ±0.003", Depth ±0.005" | The center of the score line is the board edge; plan copper clearance accordingly. |
| Hole Size | Plated (<0.247") ±0.003"; non-plated (<0.250") ±0.002"; larger holes ±0.005" | Plating reduces finished hole size; allow for plating in your design. |
| Slots | ±0.005" (≈0.13mm) | |
| Internal Cutouts | Non-plated ±0.005", plated ±0.010" | |
| Thickness | ±10% or ±0.005", whichever is greater | |
| Trace Width | ±20% | For impedance-controlled boards, specify target impedance so we can adjust trace width. |
| Copper-to-Copper Spacing | ±20% | |
| Soldermask Registration | ±0.003", Depth ±0.005" | Soldermask clearance should be 0.003" larger than pads (mask swell); pads within 0.010" may need special processing. |
1 inch = 25.4 mm. Values shown per IPC-6012 acceptability standards.
Need tighter tolerances?
Talk to our engineering team about your specific requirements.