Heavy Copper PCB
Heavy Copper PCB

Heavy Copper PCB

Heavy copper PCBs feature 3oz+ copper thickness, designed for high-current and high-power applications. Excellent thermal dissipation and current-carrying capacity, widely used in power supplies, automotive electronics, and industrial control systems.

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Technical Specifications

Copper Thickness3oz - >12oz
Layers1-16 layers
Board Thickness0.8mm - 6.0mm
Min. Trace Width6mil
Surface FinishHASL/ENIG/OSP
Base MaterialFR-4 TG170/TG180

Product Features

Copper thickness 3oz->12oz available
Excellent thermal performance
High current carrying capacity
Multi-layer lamination process
Impedance control ±10%
Multiple surface finish options

Applications

Power Converters
Automotive Electronics
Industrial Control Systems
Welding Equipment
UPS Power Supplies
Solar Inverters

FAQ

What is the maximum copper thickness?
We can manufacture PCBs with over 12oz copper thickness for extreme high-current applications.
What is the typical lead time?
Standard lead time is 7-10 working days, with rush options available in 5 working days.
What surface finishes are available?
We support HASL, ENIG, OSP and other surface finishes based on application requirements.
Are you a heavy copper PCB manufacturer?
Yes. Sunking is a China heavy copper PCB manufacturer producing 3oz to over 12oz boards in volume for power, automotive and industrial customers. As experienced heavy copper PCB manufacturers we handle everything from prototype to mass production, including multilayer heavy copper stackups.
Do you make industrial heavy copper PCBs?
Yes. We build industrial heavy copper PCBs for high-current applications such as industrial power supplies, inverters, welding equipment and motor drives, with 3oz+ copper for strong thermal dissipation and current-carrying capacity under sustained high-temperature, high-load operation.
How do you ensure heavy copper PCB quality control?
Our heavy copper PCB quality control covers incoming copper foil inspection, etched trace width and copper thickness measurement, multilayer lamination registration, microsection analysis and current-carrying/dielectric testing, ensuring consistent, reliable heavy copper layers to IPC-6012 Class 2/3.

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