Industrial Control

Board requirements across industrial control vary widely, and selection is usually driven by some combination of heat dissipation, signal integrity, structural space and reliability grade. Below are the engineering considerations that come up most often in this area, together with the 5 applicable board types we already manufacture.

Engineering considerations

High current and temperature rise
Copper weight in the drive and distribution sections directly sets temperature rise. Weights above 12 oz are available (16 oz and 18 oz already in production); the actual figure is reviewed against current density and permitted rise.
Long-service reliability
Industrial equipment stays in service for years, so the focus is hole-wall and interlayer reliability under temperature cycling and damp heat rather than extreme process limits. Acceptance to IPC-6012 Class II or Class III is available.

Applicable board types

The board types below are the ones that come up most often in industrial control applications. Each link goes to that board type's capability page with material, layer-count and process ranges. Combined constructions across board types, such as hybrid lamination or embedded copper, are confirmed by engineering review.

Production examples

The examples below are desensitized: no customer information, exact outline dimensions or full stack-up notation.

  • Analogue-to-digital conversion control board

    18L · FR-4 VT47 · 2.46 mm · ENIG 2µin · IPC-6012 Class 3 · Large format (long edge above roughly 250 mm)

    • 18-layer high-layer-count build accepted to IPC-6012 Class 3, with hole-wall copper and layer-to-layer registration controlled to Class 3 requirements.
    • Through-hole resin plugging followed by electroplated fill, giving a flat pad surface for downstream assembly.
    • Includes gold fingers plated to 0.25 µm, with 0.1 mm minimum trace and space — within the standard process window.
  • Industrial control / backplane-class application

    16L · FR-4 TG170 · 2.7 mm ±10% · ENIG · Mid-size (long edge roughly 100–250 mm)

    • 16 layers at 2.7 mm with press-fit holes, where hole diameter accuracy and hole-wall quality directly determine press-pin reliability.
    • Customer-supplied stack-up with impedance control and serpentine length matching; impedance held to the standard ±10% (tighter targets require engineering review).
  • Interconnect inside industrial control equipment

    2L · Flex PI · 0.2 mm · ENIG 2µin · Mid-size (long edge roughly 100–250 mm)

    • Double-sided polyimide flex with coverlay on both sides instead of solder mask, balancing bend life against insulation reliability.
    • At 0.2 mm total thickness, carrier handling and tension control are what keep the process stable.
  • Industrial control main board

    6L · FR-4 TG170 · 1.6 mm ±10% · ENIG 2µin · Mid-size (long edge roughly 100–250 mm)

    • Six-layer TG170 with 0.3 mm minimum BGA pitch, combining via-in-pad and serpentine length matching, which places tight demands on solder-mask registration and copper thickness uniformity.
    • Black solder mask with yellow legend; black mask is more sensitive to exposure and development parameters, so fine-line areas need separately tuned settings.

Production experience

Related end-product categories already in volume production include Documented end-product categories in industrial control include gas analysers, intelligent monitoring systems and industrial laundry equipment.. Specific project details are covered by non-disclosure agreements and are not published.

Applicable certifications

  • ISO 9001:2015 Quality Management System — 120622-2012-AQ-RGC-RvA
  • ISO 14001:2015 Environmental Management System — 104573-2011-AE-RGC-RvA
  • RoHS Restricted Substances Test Report — WTH23H12270526C
  • REACH SVHC Test Report — WTH24H10245077C
  • UL Recognized Component (USA) — Wiring, Printed — E326765 (ZPMV2)
  • UL Recognized Component (Canada) — Wiring, Printed — E326765 (ZPMV8)

Frequently asked questions

How long does a industrial control project take from enquiry to prototype?
Quotations are returned within 30 minutes as a rule. Expedited prototype lead times run by layer count: double-sided 24 hours, 4-layer 48 hours, 6–8 layer 72 hours, 10–12 layer 96 hours; single-stage HDI at 6 layers is 48 hours. Standard lead times and production scheduling are confirmed separately against order volume.
Which inspection and material documents can you supply?
As standard we supply a certificate of conformance, material certifications with lot records, and electrical test records; impedance test reports and microsection analysis are available on request. Acceptance can be run to IPC-6012 Class II or Class III, which must be stated on the order.

This page describes general engineering considerations for this application area and the board-type capabilities we already hold. It is not a commitment on a specific project. Exact stack-up, material grade, tolerances and acceptance criteria are confirmed through engineering review and in writing.

Routine enquiries are answered within 30 minutes. Once you upload Gerber files and technical requirements, engineering returns manufacturability findings together with the quotation, so design conflicts surface before production rather than after.