Optoelectronics

Board requirements across optoelectronics vary widely, and selection is usually driven by some combination of heat dissipation, signal integrity, structural space and reliability grade. Below are the engineering considerations that come up most often in this area, together with the 3 applicable board types we already manufacture.

Engineering considerations

Ceramic substrates and thermal matching
Optoelectronic devices are sensitive to substrate thermal expansion matching the die, and ceramic substrates outperform organic laminates on conductivity and thermal match. Specific material and metallisation are reviewed against the device.
High-frequency signals and via process
High-speed channels in optical modules are sensitive to impedance consistency and via structure; resin-plugged and electroplated vias improve flatness and reliability for via-in-pad. Standard impedance tolerance is ±10%.

Applicable board types

The board types below are the ones that come up most often in optoelectronics applications. Each link goes to that board type's capability page with material, layer-count and process ranges. Combined constructions across board types, such as hybrid lamination or embedded copper, are confirmed by engineering review.

Applicable certifications

  • ISO 9001:2015 Quality Management System — 120622-2012-AQ-RGC-RvA
  • ISO 14001:2015 Environmental Management System — 104573-2011-AE-RGC-RvA
  • RoHS Restricted Substances Test Report — WTH23H12270526C
  • REACH SVHC Test Report — WTH24H10245077C
  • UL Recognized Component (USA) — Wiring, Printed — E326765 (ZPMV2)
  • UL Recognized Component (Canada) — Wiring, Printed — E326765 (ZPMV8)

Frequently asked questions

How long does a optoelectronics project take from enquiry to prototype?
Quotations are returned within 30 minutes as a rule. Expedited prototype lead times run by layer count: double-sided 24 hours, 4-layer 48 hours, 6–8 layer 72 hours, 10–12 layer 96 hours; single-stage HDI at 6 layers is 48 hours. Standard lead times and production scheduling are confirmed separately against order volume.
Which inspection and material documents can you supply?
As standard we supply a certificate of conformance, material certifications with lot records, and electrical test records; impedance test reports and microsection analysis are available on request. Acceptance can be run to IPC-6012 Class II or Class III, which must be stated on the order.

This page describes general engineering considerations for this application area and the board-type capabilities we already hold. It is not a commitment on a specific project. Exact stack-up, material grade, tolerances and acceptance criteria are confirmed through engineering review and in writing.

Routine enquiries are answered within 30 minutes. Once you upload Gerber files and technical requirements, engineering returns manufacturability findings together with the quotation, so design conflicts surface before production rather than after.