HDI PCB
HDI (High Density Interconnect) PCBs utilize microvia and fine line technology for maximum wiring density. Essential for smartphones, tablets, and wearable devices requiring miniaturization.
Technical Specifications
| Layers | 4-20 layers |
| Min. Trace Width/Space | 2mil/2mil |
| Laser Via Diameter | 0.075mm |
| Layer-to-Layer Registration | ±25μm |
| Build-Up Structure | 1+N+1 to 4+N+4 |
| Base Material | FR-4/BT/ABF |
Product Features
Applications
FAQ
What is the minimum via size?
How many HDI build-ups are supported?
What is the minimum trace/space?
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