Aerospace
Board requirements across aerospace vary widely, and selection is usually driven by some combination of heat dissipation, signal integrity, structural space and reliability grade. Below are the engineering considerations that come up most often in this area, together with the 4 applicable board types we already manufacture.
Engineering considerations
- High-reliability acceptance class
- Applications of this kind typically require IPC-6012 Class III acceptance, with stricter criteria for hole-wall copper, layer registration and plating integrity than Class II. Manufacture and inspection can be organized to Class III.
- Material and thermal matching
- Where the temperature span is wide, matching material Tg and thermal expansion matters more than layer count alone. High-Tg (>170°C) and hybrid high-frequency constructions are available; specific grades are reviewed per project.
Applicable board types
The board types below are the ones that come up most often in aerospace applications. Each link goes to that board type's capability page with material, layer-count and process ranges. Combined constructions across board types, such as hybrid lamination or embedded copper, are confirmed by engineering review.
Production examples
The examples below are desensitized: no customer information, exact outline dimensions or full stack-up notation.
RF / microwave module
4L · Isola 370HR + Rogers RO4003C · 0.762 mm ±0.076 mm · ENIG · Compact (long edge within roughly 100 mm)
- Hybrid lamination of 370HR with RO4003C: the two materials differ in thermal expansion and resin flow, so stack-up symmetry and press parameters are the main engineering challenge on this type of board.
- Via-in-pad with resin plugging, avoiding solder wicking and voiding on the pad.
- An embedded copper coin provides the thermal path for a local high-power device, with board thickness held to ±0.076 mm.
Applicable certifications
- ISO 9001:2015 Quality Management System — 120622-2012-AQ-RGC-RvA
- ISO 14001:2015 Environmental Management System — 104573-2011-AE-RGC-RvA
- RoHS Restricted Substances Test Report — WTH23H12270526C
- REACH SVHC Test Report — WTH24H10245077C
- UL Recognized Component (USA) — Wiring, Printed — E326765 (ZPMV2)
- UL Recognized Component (Canada) — Wiring, Printed — E326765 (ZPMV8)
Frequently asked questions
- How long does a aerospace project take from enquiry to prototype?
- Quotations are returned within 30 minutes as a rule. Expedited prototype lead times run by layer count: double-sided 24 hours, 4-layer 48 hours, 6–8 layer 72 hours, 10–12 layer 96 hours; single-stage HDI at 6 layers is 48 hours. Standard lead times and production scheduling are confirmed separately against order volume.
- Which inspection and material documents can you supply?
- As standard we supply a certificate of conformance, material certifications with lot records, and electrical test records; impedance test reports and microsection analysis are available on request. Acceptance can be run to IPC-6012 Class II or Class III, which must be stated on the order.
This page describes general engineering considerations for this application area and the board-type capabilities we already hold. It is not a commitment on a specific project. Exact stack-up, material grade, tolerances and acceptance criteria are confirmed through engineering review and in writing.
Routine enquiries are answered within 30 minutes. Once you upload Gerber files and technical requirements, engineering returns manufacturability findings together with the quotation, so design conflicts surface before production rather than after.