PCB Case Studies

Cases are anonymised: no customer names, exact outlines or full stack-ups. Photos show similar boards.

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  01Analogue-to-digital conversion control board

  18 layers to IPC Class 3, with resin-plugged and plated-over through holes

  Layers

  18L

  Laminate

  FR-4 VT47

  Thickness

  2.46 mm

  Finish

  ENIG 2µin

  Size

  Large format (long edge above roughly 250 mm)

  Acceptance

  IPC-6012 Class 3

  • IPC-6012 Class 3; hole-wall copper and layer registration
  • Through-hole resin plugging · plated-over fill
  • Gold fingers 0.25 µm; minimum trace/space 0.1 mm

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  02RF / microwave module

  370HR and RO4003C hybrid lamination, with an embedded copper coin under the power device

  Layers

  4L

  Laminate

  Isola 370HR + Rogers RO4003C

  Thickness

  0.762 mm ±0.076 mm

  Finish

  ENIG

  Size

  Compact (long edge within roughly 100 mm)

  • 370HR + RO4003C hybrid lamination
  • Via-in-pad · resin plugging
  • Embedded copper coin; thickness tolerance ±0.076 mm

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  03Industrial control / backplane-class application

  16 layers at 2.7 mm, with press-fit holes accurate enough for reliable pins

  Layers

  16L

  Laminate

  FR-4 TG170

  Thickness

  2.7 mm ±10%

  Finish

  ENIG

  Size

  Mid-size (long edge roughly 100–250 mm)

  • Press-fit holes
  • Customer stack-up · serpentine length matching; impedance ±10%

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  04Interconnect inside industrial control equipment

  0.2 mm double-sided polyimide flex with coverlay on both sides, for flex life and insulation

  Layers

  2L

  Laminate

  Flex PI

  Thickness

  0.2 mm

  Finish

  ENIG 2µin

  Size

  Mid-size (long edge roughly 100–250 mm)

  • Double-sided PI flex · coverlay on both sides
  • Total thickness 0.2 mm

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  05Automotive / industrial control board

  4-layer automotive board built under IATF 16949, 100% flying-probe tested

  Layers

  4L

  Laminate

  FR-4 TG135

  Thickness

  1.6 mm ±10%

  Finish

  无铅喷锡 / Lead-free HASL

  Size

  Mid-size (long edge roughly 100–250 mm)

  • Process control and records under IATF 16949
  • 100% flying-probe electrical test · CNC routing

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  06Industrial control main board

  0.3 mm BGA pitch with via-in-pad and length-matched routing under black solder mask

  Layers

  6L

  Laminate

  FR-4 TG170

  Thickness

  1.6 mm ±10%

  Finish

  ENIG 2µin

  Size

  Mid-size (long edge roughly 100–250 mm)

  • BGA pitch 0.3 mm · via-in-pad · length matching
  • Black solder mask · yellow legend

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  07Consumer terminal and smart-home module

  IT-180A with immersion silver, via-in-pad and press-fit holes, vacuum-packed

  Layers

  4L

  Laminate

  FR-4 ITEQ IT-180A

  Thickness

  1.6 mm ±10%

  Finish

  沉银 / Immersion silver

  Size

  Mid-size (long edge roughly 100–250 mm)

  • Immersion silver · vacuum anti-oxidation packaging
  • Via-in-pad · press-fit holes · customer stack-up