Volume PCB Manufacturing
Volume depends on release discipline and consistency — from pilot approval to split deliveries, MES traceability holds every lot.
Since
2009
Bases
Huizhou + Ji'an
Phase-1 area
140,000 m²
Monthly capacity
~160,000 m²
ISO 9001ISO 14001IATF 16949ISO 13485ULRoHS / REACH
6 invention patents + 32 utility model patents
Dual-base volume capacity
Huizhou base (since 2009)
- 20,000 m² area; 60,000 m²/month
- Focus: BT, polymer, COB, telecom module boards
Ji'an base (since 2023)
- 120,000 m² area; phase-1 100,000 m²/month
- ~80% 2L/multilayer + 20% HDI; IC substrate capability under active development
Volume control spine
Production release
Lock Gerber/drawing revision, material, stack-up and finish before release.
Pilot handoff
Pilot feedback feeds volume parameters — avoid scaling known issues.
Lot delivery
Coordinate lot ID, acceptance and split shipments; delivery yield 99.8%.
Digital & quality
- ERP + MES full-chain visibility and fast traceability
- Scrap controlled below 0.3%; PDCA continuous improvement
- Inner/outer 100% AOI; fixture electrical test for volume
Quote response (tiered)
| Board class | Quote turnaround |
|---|---|
| 1–4 Layers | 10 min |
| 6–10 Layers | 30 min |
| 12–18 Layers | 2 hours |
| 18–28 Layers | 1 day |
| Complex boards | ≤ Next day |
Project inputs & review
- Gerber files and fabrication drawing (with revision)
- Order quantity, split schedule and target dates
- Material, stack-up, finish and acceptance criteria
Send us the engineering package for this board type
After engineering review we return manufacturability feedback and a quotation. Extreme parameters are reviewed as a combination of material, stack-up and process — not promised as a default simultaneous window.