Ceramic PCB Manufacturing
Ceramic boards follow a specialty-material path — confirm substrate system and processable limits before pattern and finish.
Since
2009
Bases
Huizhou + Ji'an
Phase-1 area
140,000 m²
Monthly capacity
~160,000 m²
ISO 9001ISO 14001IATF 16949ISO 13485ULRoHS / REACH
6 invention patents + 32 utility model patents
Ceramic / specialty material notes
- Ceramic and PTFE HF hybrids: capability table restricts laser drill and lamination — review per order
- Match CTE/thermal conductivity with patterning before copying FR-4 design rules
- Write withstand/thermal-stress tests into acceptance per application
Inspection & evidence
- Inner & outer layer 100% AOI
- Flying probe for prototypes; fixture test for volume
- ENIG nickel/gold thickness via XRF
- Impedance boards verified with TDR coupons
- Multilayer X-ray registration; microsection sampling for stack-up
- Delivery yield 99.8%; scrap controlled below 0.3%
Application context
Power & thermal
Modules and power designs needing high thermal paths.
RF-related
Scenes sensitive to dielectric stability — confirm material and structure together.
Engineering support
If ceramic fit is unclear, start with material/structure feasibility discussion.
Project inputs & review
- Ceramic/material system and target thermal/electrical performance
- Gerber, outline and hole/slot feasibility notes
- Quantity, schedule and acceptance/test requirements
Send us the engineering package for this board type
After engineering review we return manufacturability feedback and a quotation. Extreme parameters are reviewed as a combination of material, stack-up and process — not promised as a default simultaneous window.