Sunking PCB

High Frequency/Speed PCB Manufacturing

Treat material, stack-up and impedance as one engineering problem — we can review HF/high-speed boards, not only run standard FR-4 routes.

Since
2009
Bases
Huizhou + Ji'an
Phase-1 area
140,000 m²
Monthly capacity
~160,000 m²
ISO 9001ISO 14001IATF 16949ISO 13485ULRoHS / REACH

6 invention patents + 32 utility model patents

HF / high-speed engineering focus

Listed materials ≠ stocked inventory.

  • Separate RF vs high-speed digital early: Dk/Df, loss and hybrid compatibility reviewed first
  • Public impedance claim commonly ±5%; exact tolerance confirmed per target impedance and structure (order governs if tiered sheet values apply)
  • Ceramic/PTFE HF hybrids: laser drill and lamination limits follow capability-table conditions — not assumed equal to standard HDI
  • Signal lab supports impedance testing; TDR coupon closed loop

Material & hybrid collaboration

Material families

Capability coverage includes Shengyi, KB, NanYa, Rogers, Taconic, Isola, Arlon, Panasonic families.

Hybrid stack-up

Confirm press window, copper foil type and dielectric thickness together — not surface material alone.

Manufacturability

Align drill method, surface finish and impedance coupon placement before release.

HF / high-speed inspection

  • Inner & outer layer 100% AOI
  • Flying probe for prototypes; fixture test for volume
  • ENIG nickel/gold thickness via XRF
  • Impedance boards verified with TDR coupons
  • Multilayer X-ray registration; microsection sampling for stack-up
  • Delivery yield 99.8%; scrap controlled below 0.3%
  • TDR impedance results vs design target
  • Dielectric thickness / stack-up microsection sampling

Application context

5G / fiber modules

Telecom and optical-module contexts shown in company materials.

RF front-end

Links sensitive to Dk stability and loss.

High-speed digital

Designs needing stricter differential, return-path and reference integrity.

FAQ

Can you guarantee a specific material in stock?
Capability coverage is not inventory; lead time and alternates are confirmed at quote.

Project inputs & review

  • Gerber/stack-up and impedance targets (SE/diff)
  • Specified material P/N or acceptable alternates
  • Hybrid / special drill constraint notes
  • Quantity, schedule and acceptance criteria

Send us the engineering package for this board type

After engineering review we return manufacturability feedback and a quotation. Extreme parameters are reviewed as a combination of material, stack-up and process — not promised as a default simultaneous window.