Rigid-Flex PCB Manufacturing
Rigid-flex success sits in the transition — rigid/flex stack-up, coverlay and stress path must be reviewed together.
Since
2009
Bases
Huizhou + Ji'an
Phase-1 area
140,000 m²
Monthly capacity
~160,000 m²
ISO 9001ISO 14001IATF 16949ISO 13485ULRoHS / REACH
6 invention patents + 32 utility model patents
Rigid-flex narrative
Transition engineering
Confirm flex layers, rigid layers and bond-region dielectric/copper before release.
Assembly interface
Stiffener, connector and SMT flatness affect assembly — mark clearly on drawings.
Reliability evidence
Microsection, electrical test and optional environmental sampling for process evidence.
Process control points
- Review rigid-flex stack-up and press sequence to surface bond-region void/delam risks early
- Align flex coverlay/openings with rigid solder-mask boundaries
- Confirm outline and depth-control/milling margins at the transition
Rigid-flex inspection focus
- Inner & outer layer 100% AOI
- Flying probe for prototypes; fixture test for volume
- ENIG nickel/gold thickness via XRF
- Impedance boards verified with TDR coupons
- Multilayer X-ray registration; microsection sampling for stack-up
- Delivery yield 99.8%; scrap controlled below 0.3%
- Transition-zone microsection sampling
- Flex outline and coverlay registration checks
Project inputs & review
- Rigid/flex layer counts and full stack-up
- Transition, coverlay, stiffener and bend notes
- Material, finish, quantity and acceptance criteria
Send us the engineering package for this board type
After engineering review we return manufacturability feedback and a quotation. Extreme parameters are reviewed as a combination of material, stack-up and process — not promised as a default simultaneous window.