Metal-Core PCB Manufacturing
Thermal boards start with structure and dielectric — confirm metal-base type and heat path before outline and finish.
Copper-base: promote appropriately; not a primary marketing focus.
Since
2009
Bases
Huizhou + Ji'an
Phase-1 area
140,000 m²
Monthly capacity
~160,000 m²
ISO 9001ISO 14001IATF 16949ISO 13485ULRoHS / REACH
6 invention patents + 32 utility model patents
Metal-core customization
Aluminum base
Common for LED/power heat paths; process parameters per aluminum capability sheet.
Copper base
Evaluate copper base for higher thermal demand; offered selectively and confirmed per order.
Dielectric & voltage
Dielectric thickness, thermal conductivity and voltage targets are not interchangeable — review together.
Process control
- Match metal-base material/thickness with circuit copper weight
- Control stress and burrs in machining (outline, slots, holes) on metal base
- Confirm surface finish and solderability for the application
Metal-core inspection
- Inner & outer layer 100% AOI
- Flying probe for prototypes; fixture test for volume
- ENIG nickel/gold thickness via XRF
- Impedance boards verified with TDR coupons
- Multilayer X-ray registration; microsection sampling for stack-up
- Delivery yield 99.8%; scrap controlled below 0.3%
- Dielectric withstand / thermal items per order requirements
Project inputs & review
- Al or Cu base, base thickness, thermal/voltage targets
- Gerber, outline and slot/hole requirements
- Finish, quantity and acceptance criteria
Send us the engineering package for this board type
After engineering review we return manufacturability feedback and a quotation. Extreme parameters are reviewed as a combination of material, stack-up and process — not promised as a default simultaneous window.