HDI PCB Manufacturing
Engineering manufacturing for high-density interconnect — we understand blind/buried vias, microvias and build-up lamination, and control the process under IPC practice.
6 invention patents + 32 utility model patents
Why source HDI with Sunking
Process literacy
Laser/mechanical drilling coordination, sequential registration and via fill/resin plug are reviewed against the stack-up — not a parameter laundry list.
Base mix
Ji'an phase-1 runs ~20% HDI; Huizhou focuses on telecom modules/COB/specialty materials — complex interconnect can be engineered across bases.
Process evidence
Inner/outer AOI, X-ray registration, microsection and electrical test closed loop; delivery yield 99.8%.
HDI step window
Steps interact with via structure, material and thickness — not marketed as stackable standalone extremes.
| Stage | Steps | Note |
|---|---|---|
| Sample / development | 1–5 steps | ≥6 steps require dedicated review |
| Volume production | 1–3 steps | Higher steps confirmed via DFM |
Any-layer and similar complex interconnect enter engineering review against stack-up and reliability needs.
HDI process control focus
- Coordinate laser microvias (min. 0.075 mm) with mechanical holes (min. finished 0.15 mm)
- Confirm blind/buried via stack-up, build-up sequence and lamination registration window
- Match via fill / resin plug plan with surface finish (in-house ENIG / OSP / resin-plug lines)
- Design to the public 2/2 mil minimum window; actual limits tighten with copper weight and construction
HDI inspection focus
Beyond the common closed loop, HDI emphasizes microvia, plug and registration evidence.
- Inner & outer layer 100% AOI
- Flying probe for prototypes; fixture test for volume
- ENIG nickel/gold thickness via XRF
- Impedance boards verified with TDR coupons
- Multilayer X-ray registration; microsection sampling for stack-up
- Delivery yield 99.8%; scrap controlled below 0.3%
- Microvia/blind-via microsection sampling for wall and dielectric integrity
- Resin-plug / fill flatness check before solder mask and finish
Typical application context
Telecom & modules
Telecom module boards and optical-module-related HDI.
Automotive electronics
Automotive-related PCB manufacturing under IATF 16949 (certified scope excludes product design).
Compact industrial & devices
Space-constrained designs needing blind/buried vias to shrink layer count or size.
FAQ
- Do I need HDI?
- Evaluate HDI when through-holes cannot meet BGA density, impedance or thickness goals; we start with DFM and structure advice.
- Can any-layer go straight to volume?
- Complex interconnect starts with sample/pilot validation; volume window centers on 1–3 steps, higher structures confirmed case by case.
Project inputs & review
- Gerber/ODB++ and fabrication drawing
- Blind/buried/microvia structure notes and stack-up
- Material P/N, impedance requirements and acceptance criteria
- Quantity, schedule and sample vs volume stage
Send us the engineering package for this board type
After engineering review we return manufacturability feedback and a quotation. Extreme parameters are reviewed as a combination of material, stack-up and process — not promised as a default simultaneous window.