Flexible PCB Manufacturing
Flex is not a thinner rigid board — construction type, bend area, coverlay and stiffener define the process route.
Since
2009
Bases
Huizhou + Ji'an
Phase-1 area
140,000 m²
Monthly capacity
~160,000 m²
ISO 9001ISO 14001IATF 16949ISO 13485ULRoHS / REACH
6 invention patents + 32 utility model patents
Flex customization focus
Construction first
Single-/double-sided/multilayer flex routes differ — lock construction before quote.
Coverlay & stiffener
Mark stiffener material (PI/FR4/SUS, etc.) and thickness at connectors, SMT and screw areas.
Dev vs volume tiers
Capability sheet splits development vs mass-production — design to the volume column.
Key flex windows (from capability sheet)
| Parameter | Development | Mass production |
|---|---|---|
| Layer count | 1–12L | 1–10L |
| Max finished size | 240×1100 mm | 240×650 mm |
| Board thickness | 0.05–0.75 mm | Same |
| Min CNC hole | 0.2 mm | 0.2 mm |
| Min laser hole | 0.1 mm | 0.1 mm |
Full parameters on the flex capability table page; extremes are not assumed simultaneous.
Process control
- Bend-area opening/coverlay alignment and outline tolerance control
- Optional EMI film/aluminium sheet applied per drawing zones
- Align surface finish with volume pad/gold-finger windows
Flex inspection points
- Inner & outer layer 100% AOI
- Flying probe for prototypes; fixture test for volume
- ENIG nickel/gold thickness via XRF
- Impedance boards verified with TDR coupons
- Multilayer X-ray registration; microsection sampling for stack-up
- Delivery yield 99.8%; scrap controlled below 0.3%
Project inputs & review
- Construction type (SS/DS/ML) and layer count
- Bend zones, coverlay openings and stiffener drawing
- Material, copper weight, finish and acceptance criteria
Send us the engineering package for this board type
After engineering review we return manufacturability feedback and a quotation. Extreme parameters are reviewed as a combination of material, stack-up and process — not promised as a default simultaneous window.