Advanced PCB Manufacturing
Advanced boards are routed first, then reviewed — match the right process narrative to HDI, HF, rigid-flex or heavy copper instead of one generic pitch.
Since
2009
Bases
Huizhou + Ji'an
Phase-1 area
140,000 m²
Monthly capacity
~160,000 m²
ISO 9001ISO 14001IATF 16949ISO 13485ULRoHS / REACH
6 invention patents + 32 utility model patents
Conventional public window
Conventional layers
1–40L
Min. trace / space
2/2 mil
Min. mechanical hole
0.15 mm
Min. laser hole
0.075 mm
Aspect ratio
Up to 20:1
Impedance control
±5% (common public claim)
Go to board-type capability pages
How advanced work is handled
Structure triage
Identify the dominant constraint first: density, material, thermal, current or bend.
Parameter tiers
Sample and volume windows may differ; DFM feedback is stage-aware.
Evidence loop
AOI, electrical test, X-ray, microsection and impedance selected by structure.
Equipment & digital backbone
- Laser drilling and lamination lines
- LDI pattern exposure in Class 10K cleanroom
- Fully automatic VCP plating line
- In-house ENIG, OSP and resin-plug lines
- Online AOI, AVI and automatic electrical test
- ERP + MES full-chain traceability
Project inputs & review
- Dominant constraint notes (density/material/thermal/current/bend)
- Gerber, stack-up and specialty process requirements
- Sample or volume stage, quantity and acceptance criteria
Send us the engineering package for this board type
After engineering review we return manufacturability feedback and a quotation. Extreme parameters are reviewed as a combination of material, stack-up and process — not promised as a default simultaneous window.