IC Substrate Manufacturing
Substrate-related capability centers on materials, fine features and bonding interfaces — high layer counts are discussed as R&D/trial, not as a volume slogan.
Since
2009
Bases
Huizhou + Ji'an
Phase-1 area
140,000 m²
Monthly capacity
~160,000 m²
ISO 9001ISO 14001IATF 16949ISO 13485ULRoHS / REACH
6 invention patents + 32 utility model patents
Substrate-related positioning
Huizhou material focus
BT materials, polymer, COB and telecom module boards are Huizhou's stated focus.
Ji'an development build-up
Ji'an continues investing equipment, people and process know-how for IC substrate-related capability.
Layer-count wording
Profile text may mention up to 64L for R&D/trial — not a claim of stable volume 64L IC substrate.
Engineering focus
- Confirm substrate (incl. BT) and finish (incl. wire-bond related interfaces) per application
- Review fine-line and microvia windows against the order structure — no stacked extremes
- Capture size, gold thickness and test requirements in acceptance — no verbal defaults
Inspection & traceability
- Inner & outer layer 100% AOI
- Flying probe for prototypes; fixture test for volume
- ENIG nickel/gold thickness via XRF
- Impedance boards verified with TDR coupons
- Multilayer X-ray registration; microsection sampling for stack-up
- Delivery yield 99.8%; scrap controlled below 0.3%
Project inputs & review
- Application type (COB/module/substrate-like) and material requirements
- Stack-up, trace/via structure and finish (incl. gold thickness)
- Sample/trial/volume stage and acceptance criteria
Send us the engineering package for this board type
After engineering review we return manufacturability feedback and a quotation. Extreme parameters are reviewed as a combination of material, stack-up and process — not promised as a default simultaneous window.