Key Products
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10 - Layer - Multilayer with impedance control and plugged Vias
Format: 10 - Layer - Multilayer
Size: 100,00mm x 80,00mm
Material: FR4 Tg 150 (Special Layer Construction)
Surface: chemical gold 2U
Min Track / Space: 100μm
Min. Drill Dia.: 0.15mm
Soldermask: Top + Bottom, green
Marking Print: Top + Bottom, white
E-Test: Yes
Layer buildup: Custom
Impedance control: Yes, 10% tolerance
Plugged Via: IPC 4761 Type III & IV
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8L board with filled and capped vias
Format: 8 - Layer - Multilayer
Size: 199,01mm x 100,58mm = 2,00dm2
Material: FR4 Tg 150 (Special Layer Construction)
Surface: chemical gold 2U
Min Track / Space: 100μm
Min. Drill Dia.: 0.2mm
Soldermask: Top + Bottom, green
Marking Print: without
E-Test: Yes
Layer buildup: Custom
Impedance control: Yes, 10% tolerance
Filled & Capped Via: IPC 4761 Type VII
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Standard 8L board with ENIG surface finishing
Format: 8 - Layer - Multilayer
Size: 120,00mm x 120,00mm = 1,44dm2
Material: FR4 Tg 150 1.55mm OL:35μm / IL:35μm Cu
Surface: chemical gold 2U
Min Track / Space: 100μm
Min. Drill Dia.: 0.15mm
Soldermask: Top + Bottom, green
Marking Print: Top + Bottom, white
E-Test: Yes
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sk777A211218
Type: 32-Pieces-Simple Panel
Format: 2L Copper substrate
Material: VT4B3
Surface: Chemical gold 2U
Min Track / Space: 100µm
Min. Drill Dia.: 0.1mm
Soldermask: Top + Bottom
Marking Print: White
E-Test: Yes
Sideplating: Yes
Burried Vias: Yes
Blind Vias: Yes
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sk260D113618
Type: 32-Pieces-Simple Panel
Format: 2L Copper substrate
Material: VT4B3
Surface: Chemical gold 2U
Min Track / Space: 100µm
Min. Drill Dia.: 0.1mm
Soldermask: Top + Bottom
Marking Print: White
E-Test: Yes
Sideplating: Yes
Burried Vias: Yes
Blind Vias: Yes
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sk918A196568
Type: 32-Pieces-Simple Panel
Format: 2L Copper substrate
Material: VT4B3
Surface: Chemical gold 2U
Min Track / Space: 100µm
Min. Drill Dia.: 0.1mm
Soldermask: Top + Bottom
Marking Print: White
E-Test: Yes
Sideplating: Yes
Burried Vias: Yes
Blind Vias: Yes
