SUNKING CIRCUITS ELECTRONICS TECHNOLOGY LIMITED

PCBA Capabilities

We are professional on PCB and turnkey PCBA solution, owing to the past over 15 years rich experience of manufacturing

PCB Assembly

Sunking is your ideal partner for high-quality, medium and high volume electronic manufacturing, We offer a number of services including traditional PCB assembly and Surface Mount (SMT) assembly. and PCB finishing processes including conformal coating and silicone potting. We can also provide supply chain management, procurement, custom packaging and much more. We also develop test equipment including in-circuit testing and functional testing for all our products.

Our Services

High-quality SMT & THT production
OEM & ODM
Procuring components (BoM management)
Selective coating and varnishing, potting technology
Laser marking, DMX-Code, labels
Sample production & complex testing to support the development cycle
PCBA burning program
ICT & FCT & Aging test
Packaging concepts & design
100% optical and functional testing

PCBA Capability

Min.Assembly Space: 0.1mm
Min.QFP Space: 0.3mm
Min. Package: ‘0201
Min. Board Size: 50*50mm
Max. Board Size: 350*1200mm
Assembly Registration: ±0.01mm
Assembly Sort: QFP,QFN,SOP,PGA,PLCC,BGA…
Assembly Capability: 1206,0805,0603,0304,0204,0201…

Quality assurance

We maintain the highest standards of quality throughout the assembly process. All circuit board assemblies are barcoded and tracked through the various manufacturing steps. Our team analyzes the data collected at each stage during production to continually enhance and improve the process.

PCB inspection

A rigorous first article inspection process is performed on each build, complemented by a robust NPI procedure for new products. We produce build documents and machine programs from your information, as well as make recommendations for your designs to streamline your products’ manufacturing process.

Our series of inspections during the PCB assembly process are designed to ensure product quality, reliability and functionality, and to reduce field failures.

Equipment Specification

MachineSolder Paste PrinterSPISMTSMTSMT
Picture
ModelDSP-1008I350aYS24YG12FYG12
BrandDESENSinic-TekYAMAHAYAMAHAYAMAHA
Board size50*50-400*340mm50*50-400*350mm0402~32*32mm L50*W50~L700*W 460mm0402~-45*100mm L50*W50mm-L510*W460mmL50*W50mm~L510*W 460mm
Electrical source220V AC220V AC/15A220V AC220V AC220V AC
Power consumption(kw)31.64.74.74.7
Air(kg/cm2)4.5~6kg/cm20.5Mpa0.45Mpa0.55Mpa0.55Mpa
CharacteristicsPrinting precision ±0.025mm Repeat accuracy ±0.01mmMinimum pad spacingSMT precision ±0.05mm( μ+3σ)、±0.03mm(3σ)Types of components120/8mmTypes of components 48/8mmTypes of components 60/8mm
MachineReflowReflowReflowAOIX-Ray
Picture
ModelHeller 1809Heller 1826FLEX XPM-2MT-2000ZM-X7800
BrandHellerHellerVitronicsMVTESEAMARK
Board size50-508mm50-560mm50-560mm25*25~368*488mm500mm*500mm
Electrical source380V100 Amp/12KVA380V 3Phase380V220VAC110-220V VAC50/60Hz
Power consumption(kw)43431241.7
Air(kg/cm2)33331.8
Characteristics


Resolution:12μm FOV:20*20mm

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