PCB Capabilities
Feature | Standard | Advanced | R&D |
---|---|---|---|
Layers count | 16 | 40 | 60 |
Minimum board thickness ( with solder mask) | 0.6mm | 0.40mm | 0.20mm |
Maximum board thickness | 4mm | 6mm | 10mm |
Minimum board size | 50mm x 50mm | 30mm x 30mm | 5mm x 5mm |
Maximum board size | 600mm x 570mm | 960mm 600mm | 1250mm x 570mm |
Minimum line/space innerlayer (depend on copper weight) | 3mil/3mil | 2.5mil/2.5mil | 2mill/2mil |
Minimum line/space outerlayer (depend on copper weight) | 4mil/4mil | 3mil/3mil | 2mil/2mil |
Surface finish types | OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board) | Plus hard gold (Selective board) soft gold, ENEPIG | Plus ISIG,EPIG |
Mechanical hole size ( Finish hole size) | 0,2 mm | 0,15 mm | 0,1 mm |
Maximum aspect ratio PTH | 10 | 16 | 20 |
Finished tolerance PTH | +/-0,075 mm | +/-0,05 mm | +/-0,025 mm |
Finished tolerance NPTH | +/-0,05 mm | +/-0,025 mm | +/-0,015 |
Epoxy filled through holes (Y/N) | Yes | Yes | Yes |
Capped via (Y/N) | Yes | Yes | Yes |
Maximum copper weight outerlayer | 3oz | 12oz | >12oz |
Maximum copper weight innerlayer | 3oz | 12oz | >12oz |
Control depth drill (Y/N) | Yes | Yes | Yes |
Tolerance depth drill | +/-0,1 mm | +/-0,075 mm | +/-0,05 mm |
Backdrill diameter | 0,50 mm | 0,35 mm | 0,25 mm |
Min. depth of backdrill | 0,25 mm | 0,20 mm | 0,15 mm |
Drill depth tolerance | +/-0,15 mm | +/- 0,10 mm | <0,10 mm |
HDI type 1+n+1 | Yes | Yes | Yes |
HDI type 2+n+2 | Yes | Yes | Yes |
HDI type 3+n+3 | Yes | Yes | Yes |
HDI type 4+n+4 | NA | Yes | Yes |
Any layer | No | Yes | Yes |
Min. laser hole diameter | 0.075 | 0.065 | Only by request |
Microvia Max.aspect ratio | 1:1 | 1:1 | 1:1 |
Copper filled microvia | Yes | Yes | Yes |
Resin filled microvia | Yes | Yes | Yes |
Stacked &Staggered via. | Yes | Yes | Yes |
Laser via land pad size | Via diameter+0.15 mm | Via diameter+0.125 mm | Via diameter+0.1 mm |
Laser via capture pad size | Via diameter+0.25 mm | Via diameter+0.225 mm | Via diameter+0.2 mm |
Rigid-flex boards (Y/N) | Yes | Yes | Yes |
Min. width between rigid parts | 5 mm | 3mm | 2mm |
Min. Flex width | 5mm | 3mm | 2mm |
Flex boards (Y/N) | Yes | Yes | Yes |
IMS boards | Yes | Yes | Yes |
Embedded components (Y/N) | No | Yes | Yes |
Soldermask via plugging IPC4761 type VI (Y/N) | Yes | Yes | Yes |
Epoxy via plugging IPC4761 type VI(Y/N) | Yes | Yes | Yes |
FAQ
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