Type: 32-Pieces-Simple Panel

Format: 2L Copper substrate

Material: VT4B3                                                 

Surface: Chemical gold 2U

Min Track / Space: 100µm

Min. Drill Dia.: 0.1mm

Soldermask: Top + Bottom

Marking Print: White

E-Test: Yes

Sideplating: Yes

Burried Vias: Yes

Blind Vias: Yes

Type: 32-Pieces-Simple Panel

Format: 2L Copper substrate

Material: VT4B3                                                 

Surface: Chemical gold 2U

Min Track / Space: 100µm

Min. Drill Dia.: 0.1mm

Soldermask: Top + Bottom

Marking Print: White

E-Test: Yes

Sideplating: Yes

Burried Vias: Yes

Blind Vias: Yes

Type: 4-Pieces-Simple Panel

Mech. treatment: Scored

Panel-Size: 145,90mm x 160,30mm = 2,34dm2

Customer: 5974

Format: 8 - Layer - Multilayer

Material: FR4 Tg 150 1.55mm OL:35μm / IL:35μm Cu

Surface: chemical gold 2U

Min Track / Space: 125μm

Min. Drill Dia.: 0.3mm

Soldermask: Top + Bottom, green

Marking Print: without

E-Test: Yes

Type: 32-Pieces-Simple Panel

Format: 2L Copper substrate

Material: VT4B3                                                 

Surface: Chemical gold 2U

Min Track / Space: 100µm

Min. Drill Dia.: 0.1mm

Soldermask: Top + Bottom

Marking Print: White

E-Test: Yes

Sideplating: Yes

Burried Vias: Yes

Blind Vias: Yes

Format: 8 - Layer - Multilayer

Material: FR4 Tg 150 (Special Layer Construction)

Surface: chemical gold 2U

Min Track / Space: 100μm

Min. Drill Dia.: 0.2mm

Soldermask: Top + Bottom, green

Marking Print: without

E-Test: Yes

Layer buildup: Custom

Impedance control: Yes, 10% tolerance

Blind Vias: Yes