HDI Board produced with IPC Class 3 standard
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Rigid+Flex PCB
Type: 1-Pieces-Simple Panel
Mech. treatment: Milled
Format: 4 - Layer - Multilayer
Material: Rigid-Flex 1.0 OL:35µm / IL:35µm Cu
Surface: chemical gold 2U
Min Track / Space: 150µm
Min. Drill Dia.: 0.2mm
Soldermask: Top + Bottom, green
Marking Print: None
E-Test: Yes
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HDI Board produced with IPC Class 3 standard
Format: 8 - Layer - Multilayer
Size: 306,00mm x 313,00mm = 9,58dm2
Material: FR4 Tg 150 1.55mm OL:70μm / IL:70μm Cu
Surface: galv. hard gold 30U
Min Track / Space: 150μm
Min. Drill Dia.: 0.2mm
Solderstop: without
Marking Print: without
E-Test: Yes
Blind Vias: Yes
Filled & Capped Via: IPC 4761 Type VII
IPC class 3: Yes
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Carbon print PCB
Panel: 8019.01_0394271-01
Type: 15-Pieces-Simple Panel
Format: 8 - Layer - Multilayer
Surface:Chemical gold 2U
Mech. treatment:Milled with perf.bridges
Panel-Size: 172,80mm x 99,50mm = 1,72dm²
Material: FR4 Tg 150 S1000H 1.0mm OL:35µm / IL:35µm Cu
Min Track / Space:100µm
Min. Drill Dia:0.1mm
Soldermask: Top + Bottom, green
Marking Print: without
E-Test: Yes
Sideplating: Yes
Burried Vias: Yes
Blind Vias: Yes
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High-Frequency PCB
Format: 2 - Layer - Plated through
Size: 107,00mm x 87,00mm = 0,93dm²
Material: Rogers 4350B 1.55mm 70µm Cu
Surface: chemical gold 2U
Min Track / Space: 200µm
Min. Drill Dia.: 0.3mm
Solderstop: without
Marking Print: without
E-Test: Yes
